Role Overview
As a Power Delivery Solution Architect, you will play a central technical role in advancing the adoption of our chiplet-based power delivery network solution. You'll work directly with leading semiconductor customers to integrate our technology into high-performance GPU and CPU SoC designs, ensuring optimal power integrity and system performance.
Key Responsibilities
- Guide customers in designing power delivery solutions using our chiplet technology for advanced SoC architectures
- Support optimization of power delivery networks using our proprietary design tools and kits
- Collaborate across the customer lifecycle—from early simulation and modeling to physical implementation and system validation
- Collect and analyze technical feedback to inform product improvements and enhance customer enablement
- Serve as the primary technical liaison for tier-one customers, ensuring clear communication and alignment
- Handle sensitive design data with the highest level of confidentiality and professionalism
Qualifications
You bring extensive experience in power and signal integrity for complex SoC designs. Your background includes hands-on work with electrical modeling, simulation workflows, and advanced packaging technologies.
- 8+ years focused on power integrity, signal integrity, or related fields for high-performance SoCs
- Proficient in PI/SI simulation tools and analysis methodologies
- Experience extracting, building, and validating electrical models for SoC packages
- Strong knowledge of package-level power and signal integrity, including substrates, interposers, and 2.5D/3D integration
- Proven ability to debug issues across simulation and lab testing environments
- Excellent communication skills with a track record of engaging technical teams at customer sites
- Self-driven with strong problem-solving skills and the ability to operate independently
Preferred Experience
- Work history at a major processor or ASIC developer in power or signal integrity roles
- Leadership experience in engineering or technical project management
- Hands-on lab experience with power integrity test setups and instrumentation
- Familiarity with advanced packaging platforms such as CoWoS and 2.5D integration
Work Environment
This is a hybrid role with primary locations in Chandler, AZ, Vancouver, WA, and Silicon Valley, CA. Candidates are expected to be onsite at least three days per week. Exceptional candidates based in Silicon Valley may qualify for increased remote flexibility.
Compensation & Benefits
Base salary ranges from $180,000 to $250,000, depending on experience. The package includes stock options and a comprehensive benefits plan covering health, dental, vision, and 401(k) contributions.
Culture & Expectations
You will thrive in a fast-moving, entrepreneurial environment where ownership and initiative are expected. Success in this role means anticipating technical challenges, guiding both internal teams and customers, and contributing directly to product evolution. We value technical depth, discretion, and the ability to drive solutions with minimal oversight.
